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This will facilitate the effort needed for the integration of the module into a larger system
Specification for 150 mm (6 inch) Port
SEMI 3D11-1214 (Reapproved 1125)
• Dry etch equipment
3D02200 - SEMI 3D22 - Guide on Measurements of Openings and Vias in Glass Revision:SEMI 3D22-1219 (Reapproved 0525) - Current This will facilitate the effort1 Purpose 1. 1 Through glass vias is an emerging technology in the semiconductor industry. Definitions for openings in glass have been described in SEMI 3D11, and a specification for glass as substrate for semiconductor applications with or without openings has been laid out in SEMI 3D16. However, there are few or no agreed upon test methods for measuring the physical and dimensional properties of through glass vias or other openings in glass or the
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